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參數(shù)資料
| 型號： | X95840WV20I-2.7T1 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP QUAD 256TAP 10K 20-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | XDCP™ |
| 接片： | 256 |
| 電阻（歐姆）： | 10k |
| 電路數(shù)： | 4 |
| 溫度系數(shù)： | 標(biāo)準(zhǔn)值 ±45 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | I²C（設(shè)備位址） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-TSSOP |
| 包裝： | 帶卷 (TR) |
13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8213.2
July 5, 2006
X95840
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. E 12/02
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
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| X95840WV20IZ-2.7 | 功能描述:IC XDCP QUAD 256TAP 10K 20-TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 接片:256 電阻（歐姆）:100k 電路數(shù):2 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲器類型:易失 接口:6 線串行（芯片選擇，遞增，增/減） 電源電壓:2.6 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR) |
| X95840WV20IZ-2.7T1 | 功能描述:IC POT DGTL QUAD 10K OHM 20TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 接片:256 電阻（歐姆）:100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 35 ppm/°C 存儲器類型:非易失 接口:3 線串口 電源電壓:2.7 V ~ 5.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN-EP（3x3） 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:1399 (CN2011-ZH PDF) 其它名稱:MAX5423ETA+TCT |
| X95RP-2 | 功能描述:消費(fèi)電池與相機(jī)電池 D 18900mAh 2 PK Titanium Alkaline RoHS:否 制造商:FDK Batteries 電池大小:CR1/3N 輸出電壓:3 V 容量:160 mAh 化學(xué)性質(zhì):Lithium 端接類型:Pressure Contacts 可再充電/不可再充電:Non-Rechargeable |
| X95RP-4 | 功能描述:消費(fèi)電池與相機(jī)電池 NOT AVAILABLE THROUGH MOUSER RoHS:否 制造商:FDK Batteries 電池大小:CR1/3N 輸出電壓:3 V 容量:160 mAh 化學(xué)性質(zhì):Lithium 端接類型:Pressure Contacts 可再充電/不可再充電:Non-Rechargeable |
| X96010 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Sensor Conditioner with Dual Look Up Table Memory and DACs |
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