參數(shù)資料
型號(hào): X9460KV14IT1
廠商: Intersil
文件頁(yè)數(shù): 8/16頁(yè)
文件大小: 0K
描述: IC XDCP DUAL AUD 32T 33K 14TSSOP
標(biāo)準(zhǔn)包裝: 2,500
系列: XDCP™
接片: 32
電阻(歐姆): 32k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 -300 ppm/°C
存儲(chǔ)器類型: 易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
16
FN8203.2
October 17, 2005
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
Packaging Information
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
14-Lead Plastic, TSSOP, Package Type V
See Detail “A”
.031 (.80)
.041 (1.05)
.169 (4.3)
.177 (4.5) .252 (6.4) BSC
.025 (.65) BSC
.193 (4.9)
.200 (5.1)
.002 (.05)
.006 (.15)
.047 (1.20)
.0075 (.19)
.0118 (.30)
0° - 8°
.010 (.25)
.019 (.50)
.029 (.75)
Gage Plane
Seating Plane
Detail A (20X)
X9460
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