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參數(shù)資料
| 型號： | X9421YS16Z-2.7T1 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP SGL 64-TAP 2.5K 16-SOIC |
| 標準包裝： | 1,000 |
| 系列： | XDCP™ |
| 接片： | 64 |
| 電阻（歐姆）： | 2.5k |
| 電路數(shù)： | 1 |
| 溫度系數(shù)： | 標準值 ±300 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | 5 線 SPI（芯片選擇，設備位址） |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 16-SOIC |
| 包裝： | 帶卷 (TR) |
19
FN8196.4
January 14, 2009
X9421
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.041
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.195
0.199
4.95
5.05
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N14
14
7
α
0o
8o
0o
8o
-
Rev. 2 4/06
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| X9421YS16ZT1 | 功能描述:IC XDCP SGL 64-TAP 2.5K 16-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 接片:32 電阻（歐姆）:50k 電路數(shù):1 溫度系數(shù):標準值 50 ppm/°C 存儲器類型:易失 接口:3 線串行（芯片選擇，遞增，增/減） 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-6 細型，TSOT-23-6 供應商設備封裝:TSOT-23-6 包裝:帶卷 (TR) |
| X9421YS-2.7 | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally Controlled (XDCP) Potentiometer |
| X9421YSI | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally Controlled (XDCP) Potentiometer |
| X9421YSI-2.7 | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally Controlled (XDCP) Potentiometer |
| X9421YV | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:Single Digitally Controlled (XDCP) Potentiometer |
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