參數(shù)資料
型號(hào): X9269
廠商: Intersil Corporation
英文描述: 3A,400V,SILASTIC RECT.
中文描述: 單電源/低Power/256-Tap/2-Wire巴士
文件頁(yè)數(shù): 22/25頁(yè)
文件大小: 422K
代理商: X9269
X9269
REV 1.1.11 2/17/03
Characteristics subject to change without notice.
22 of 25
www.xicor.com
PACKAGING INFORMATION
16-Bump Chip Scale Package (CSP B16)
Package Outline Drawing
Ball Matrix:
4
3
2
1
A
R
H1
R
L1
R
W1
Vss
A1
A2
R
H0
R
W0
R
L0
Vcc
B
SDA
WP
C
D
A3
SCL
NC
A0
Package Dimensions
Symbol
a
b
c
d
e
f
j
k
l
m
Millimeters
Nominal
2.775
4.553
0.677
0.457
0.220
0.320
0.65
0.65
0.413
1.302
Inches
Nominal
Min
2.745
4.523
0.644
0.444
0.200
0.300
Max
2.805
4.583
0.710
0.470
0.240
0.340
Min
Max
Package Width
Package Length
Package Height
Body Thickness
Ball Height
Ball Diameter
Ball Pitch – Width
Ball Pitch – Length
Ball to Edge Spacing – Width
Ball to Edge Spacing – Length
0.388
1.277
0.438
1.327
f
b
a
A4
A3
A2
A1
e
d
Side View
j
m
l
k
Top View (Marking Side)
Bottom View (Bumped Side)
Side View
e
c
B4
B3
B2
B1
C4
C3
C2
C1
D4
D3
D2
D1
9
Y
L
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