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參數(shù)資料
| 型號： | X9015WS8ZT1 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 2/11頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XDCP SGL 32-TAP 10K 8-SOIC |
| 標準包裝： | 2,500 |
| 系列： | XDCP™ |
| 接片： | 128 |
| 電阻（歐姆）： | 10k |
| 電路數(shù)： | 1 |
| 溫度系數(shù)： | 標準值 ±300 ppm/°C |
| 存儲器類型： | 易失 |
| 接口： | 3 線串行（芯片選擇，遞增，增/減） |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
10
FN8157.5
August 31, 2006
X9015
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
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