參數(shù)資料
型號(hào)： X88C75PM
英文描述： Port Expander and E2 Memory
中文描述： 端口擴(kuò)展和E2內(nèi)存
文件頁數(shù)： 16/27頁
文件大小： 125K
代理商： X88C75PM
X88C75 SLIC
E
2
16
Notes:
(3) V
IL
min. and V
IH
max. are for reference only and are not tested.
(4) This parameter is periodically sampled and not 100% tested.
CAPACITANCE
T
A
= +25
°
C, f = 1MHz, V
CC
= 5V
Symbol
Test
Max.
Units
Conditions
C
I/O(4)
C
IN(4)
Input/Output Capacitance
Input Capacitance
10
6
pF
pF
V
I/O
= 0V
V
IN
= 0V
2887 PGM T07
POWER-UP TIMING
Symbol
Parameter
Max.
Units
t
PUR(4)
t
PUW(4)
Power-Up to Read
Power-Up to Write
1
5
ms
ms
2887 PGM T08
D.C. OPERATING CHARACTERISTICS
(Over recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Max.
Units
Test Conditions
I
CC
V
CC
Current (Active)
60
mA
CE
=
RD
= V
IL
, All I/O’s =
Open,Other Inputs = V
CC
CE
= V
IH
, All I/O’s = Open, Other
Inputs = V
CC
– 0.3V, ALE = V
IL
CE
= V
IH
, All I/O’s = Open, Other
Inputs = V
IH
, ALE = V
IL
V
IN
= V
SS
to V
CC
V
OUT
= V
SS
to V
CC
,
RD
=
PSEN
= V
IH
I
SB1(CMOS)
V
CC
Current (Standby)
100
μ
A
I
SB2(TTL)
V
CC
Current (Standby)
2
mA
I
LI
I
LO
Input Leakage Current
Output Leakage Current
10
10
μ
A
μ
A
V
lL(3)
V
IH(3)
V
OL
V
OH
Input LOW Voltage
Input HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
–1
2
0.8
V
V
V
V
V
CC
+ 0.5
0.4
I
OL
= 2.1mA
I
OH
= –400
μ
A
2.4
2887 PGM T06.2
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
0
°
C
–40
°
C
–55
°
C
Max.
+70
°
C
+85
°
C
+125
°
C
2887 PGM T04.1
Commercial
Industrial
Military
Supply Voltage
Limits
5V
±
10%
X88C75
2887 PGM T05.1
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias .................. –65
°
C to +135
°
C
Storage Temperature ....................... –65
°
C to +150
°
C
Voltage on any Pin with
Respect to V
SS
.................................. –1V to +7V
D.C. Output Current ............................................5 mA
Lead Temperature
(Soldering, 10 seconds).............................. 300
°
C
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
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