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參數(shù)資料
| 型號： | X4003M8-4.5A |
| 廠商： | INTERSIL CORP |
| 元件分類： | 電源管理 |
| 英文描述： | RTC Module With CPU Supervisor |
| 中文描述： | 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8 |
| 封裝： | 3 MM, PLASTIC, MO-187AA, MSOP-8 |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 279K |
| 代理商： | X4003M8-4.5A |
17
FN8113.1
May 11, 2006
X4003, X4005
Mini Small Outline Plastic Packages (MSOP)
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums
and
to be determined at Datum plane
.
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
Interlead flash and
L
0.25
(0.010)
L1
R1
R
4X
θ
4X
θ
GAUGE
PLANE
SEATING
PLANE
E
E1
N
1 2
TOP VIEW
INDEX
AREA
-C-
-B-
0.20 (0.008)
A
B C
SEATING
PLANE
0.20 (0.008)
C
0.10 (0.004)
C
-A-
-H-
SIDE VIEW
b
e
D
A
A1
A2
-B-
END VIEW
0.20 (0.008)
C
D
E
1
C
C
a
- H -
-A -
- B -
- H -
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
0.026 BSC
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N
8
8
7
R
0.003
-
0.07
-
-
R1
0.003
5
o
-
0.07
5
o
-
-
0
α
15
o
15
o
-
0
o
6
o
0
o
6
o
-
Rev. 2 01/03
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| X4003M8I | 功能描述:IC SUPERVISOR CPU I2C 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 監(jiān)控器 系列:- 標準包裝:100 系列:- 類型:簡單復位/加電復位 監(jiān)視電壓數(shù)目:1 輸出:- 復位:低有效 復位超時:最小為 100 ms 電壓 - 閥值:4.38V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:8-TSSOP 包裝:管件 |
| X4003M8I-2.7 | 功能描述:IC SUPERVISOR CPU I2C 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 監(jiān)控器 系列:- 標準包裝:100 系列:- 類型:簡單復位/加電復位 監(jiān)視電壓數(shù)目:1 輸出:- 復位:低有效 復位超時:最小為 100 ms 電壓 - 閥值:4.38V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:8-TSSOP 包裝:管件 |
| X4003M8I-2.7A | 功能描述:IC SUPERVISOR CPU I2C 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 監(jiān)控器 系列:- 標準包裝:100 系列:- 類型:簡單復位/加電復位 監(jiān)視電壓數(shù)目:1 輸出:- 復位:低有效 復位超時:最小為 100 ms 電壓 - 閥值:4.38V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:8-TSSOP 包裝:管件 |
| X4003M8I-4.5A | 功能描述:IC SUPERVISOR CPU I2C 8-MSOP RoHS:否 類別:集成電路 (IC) >> PMIC - 監(jiān)控器 系列:- 標準包裝:100 系列:- 類型:簡單復位/加電復位 監(jiān)視電壓數(shù)目:1 輸出:- 復位:低有效 復位超時:最小為 100 ms 電壓 - 閥值:4.38V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:8-TSSOP 包裝:管件 |
| X4003M8IZ | 功能描述:IC SUPERVISOR CPU I2C 8-MSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 監(jiān)控器 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:簡單復位/加電復位 監(jiān)視電壓數(shù)目:1 輸出:開路漏極或開路集電極 復位:低有效 復位超時:最小為 600 ms 電壓 - 閥值:3.8V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SC-74A，SOT-753 供應商設備封裝:SOT-23-5 包裝:帶卷 (TR) |
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