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參數(shù)資料
| 型號： | WS512K32V-17G1TI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| 封裝： | 23.90 MM, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大小： | 154K |
| 代理商： | WS512K32V-17G1TI |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32V-XXX
512Kx32 SRAM 3.3V MULTICHIP PACKAGE
n Low Voltage Operation:
3.3V ± 10% Power Supply
n Low Power CMOS
n TTL Compatible Inputs and Outputs
n Fully Static Operation:
No clock or refresh required.
n Three State Output.
n Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
n Weight
WS512K32V-XG1TX - 5 grams typical
WS512K32V-XG1UX1 - 5 grams typical
WS512K32V-XG2UX - 8 grams typical
WS512K32NV-XH1X - 13 grams typical
Note 1: Package Not Recommended For New Design
*This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FEATURES
n Access Times of 15, 17, 20ns
n Low Voltage Operation
n Packaging
66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
68 lead, 23.9mm (0.940 inch) sq., Low Profile CQFP,
(G1T), 4.06 (0.160 inch) high, (Package 524)
68 lead, 22.4mm (0.880 inch) CQFP, (G2U),
3.56mm (0.140"), (Package 510)
68 lead, 23.9mm (0.940 inch) sq., Low Profile
CQFP, (G1U)1, 3.56mm (0.140 inch) high,
(Package 519)
n Organized as 512Kx32; User Configurable as
1Mx16 or 2Mx8
n Commercial, Industrial and Military Temperature
Ranges
PIN CONFIGURATION FOR WS512K32NV-XH1X
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
March 2003 Rev. 8
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
512K x 8
8
I/O0-7
WE CS
1
512K x 8
8
I/O8-15
WE CS
2
512K x 8
8
I/O16-23
WE CS
3
512K x 8
8
I/O24-31
WE CS
4
A0-18
OE
PRELIMINARY*
相關(guān)PDF資料 |
PDF描述 |
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| WS512K32V-15G1UI | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| WS512K48-25G4WIA | 3M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQMA116 |
| WS512K48-20G4WIA | 3M X 8 MULTI DEVICE SRAM MODULE, 20 ns, CQMA116 |
| WS512K8-25CQEA | 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDMA32 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32V-17G1UC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-17G1UCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-17G1UI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-17G1UIA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-17G1UM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
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