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參數(shù)資料
| 型號(hào)： | WS512K32NBV-17H2IEA |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 1/8頁(yè) |
| 文件大小： | 332K |
| 代理商： | WS512K32NBV-17H2IEA |
WS512K32BV-XXXE
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
December, 1999
Rev. 2
*ADVANCED
NOT
RECOMENDED
FOR
NEW
DESIGNS
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE#2
CS#2
GND
I/O11
A10
A11
A12
VCC
CS#1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
A18
WE#1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS#4
WE#4
I/O27
A3
A4
A5
WE#3
CS#3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
512Kx32 3.3V SRAM MODULE
■ 3.3V Power Supply
■ BiCMOS
■
TTL Compatible Inputs and Outputs
■ Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
■ Weight
WS512K32BV-XG2XE - 8 grams typical
WS512K32NBV-XH2XE - 13 grams typical
* This product is under development, is not qualied or characterized and is subject to
change or cancellation without notice.
FEATURES
■ Access Times of 15*, 17, 20ns
■ Low Voltage Operation
■ Packaging
66-pin, PGA Type, 1.385 inch square Hermetic
Ceramic HIP (Package 402)
68 lead, Hermetic CQFP (G2), 22mm (0.880
inch) square (Package 500). Designed to t
JEDEC 68 lead 0.990" CQFJ footprint
■ Organized as 512Kx32; User Congurable as
1Mx16 or 2Mx8
■ Radiation Tolerant with Epitaxial Layer Die
■ Commercial and Industrial Temperature Ranges
PIN CONFIGURATION FOR WS512K32NBV-XH2XE
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE#1-4
Write Enables
CS#1-4
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
512K x 8
8
I/O0-7
512K x 8
8
I/O8-15
512K x 8
8
I/O16-23
512K x 8
8
I/O24-31
A0-18
OE#
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32F-25H2QA | 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 |
| WS512K32F-35G2TMA | 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CQMA68 |
| WS512K32F-35G4TIA | 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CQMA68 |
| WS512K32F-55G2TCA | 2M X 8 MULTI DEVICE SRAM MODULE, 55 ns, CQMA68 |
| W7NCF02GH30IS2DG | 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NBV-17H2ME | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-17H2MEA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20G2 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20G2CE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 3.3V SRAM MODULE |
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