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參數(shù)資料
| 型號(hào)： | WS512K32L-15G1UCA |
| 廠(chǎng)商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| 封裝： | 23.90 X 23.90 MM, 3.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 5/13頁(yè) |
| 文件大?。?/td> | 485K |
| 代理商： | WS512K32L-15G1UCA |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32-XXX
White Electronic Designs
Rev 7
Change (Pg. 1, 3, 9)
October 2000
Final
1.1 Change Operating Supply Current from 540mA to 660mA Maximum
1.2 Add Low Power Data Retention Current of 16mA to Data Retention Characteristics table
1.3 Add Low Power Data Retention (L) option to Ordering Information
Rev 8
Change (Pg. 1, 2, 6, 7, 9, 10)
October 2001
Final
1.1 Change G2T and G4T package status to Not Recommended For New Design
Rev 9
Change (Pg. 1, 2, 3, 8, 9, 10)
November 2001
Final
1.1 Add G1T package
1.2 Remove Hi-Reliability Product Title
Rev 10
Change (Pg. 1, 2, 3, 4, 7, 8, 9, 10, 11)
August 2002
Final
1.1 Remove G2T package
1.2 Add G2U package
1.3 Remove Package to be Developed note for G4T
Rev 11
Change (Pg. 1,2,4,8,10,11,13)
February 2002
Final
1.1 Change G1U package status to Not Recommended For New Designs
Rev 12
Change (Pg. 1,2,3,7,8,10,11,13)
May 2003
Final
1.1 Add G2L package
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32N-100HC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-100HI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-17H1C | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS512K32N-17H1CA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
| WS512K32N-17H1I | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
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