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參數(shù)資料
| 型號： | WS1M32V-17G3I |
| 元件分類： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP84 |
| 封裝： | 28 MM, CERAMIC, QFP-84 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 155K |
| 代理商： | WS1M32V-17G3I |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS1M32V-XG3X
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 511: 84 LEAD, CERAMIC QUAD FLAT PACK (G3)
0.38 (0.015)
± 0.05 (0.002)
4.12 (0.162)
± 0.20 (0.008)
1.27 (0.050) TYP
29.11 (1.146)
± 0.25 (0.010)
25.40 (1.000) TYP
4.29 (0.169)
± 0.28 (0.011)
0.19 (0.008)
± 0.06 (0.003)
1.02 (0.040)
± 0.12 (0.005)
0.25 (0.010)
1
° / 7°
R 0.127
(0.005) MIN
DETAIL A
SEE DETAIL "A"
Pin 1
0.27 (0.011)
± 0.04 (0.001)
+
30.23 (1.190)
± 0.25 (0.010) SQ
27.18 (1.070)
± 0.25 (0.010) SQ
The WEDC 84 lead G3 CQFP fills
the same fit and function as the
JEDEC 84 lead CQFJ or 84 PLCC.
But the G3 has the TCE and lead
inspection advantage of the
CQFP form.
1.146"
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS1M32V-17G3IA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3M | 制造商:Microsemi Corporation 功能描述:1M X 32 SRAM MODULE, - Bulk |
| WS1M32V-17G3MA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3C | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3CA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
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