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參數(shù)資料
| 型號(hào)： | WS1M32-20H2C |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 1/7頁(yè) |
| 文件大?。?/td> | 479K |
| 代理商： | WS1M32-20H2C |
WS1M32-XH2X
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
March 2009
Rev. 8
1Mx32 SRAM MODULE
FEATURES
Access Times of 20, 25ns
Packaging
66 pin PGA Type, 1.385" sq., Hermetic Ceramic
HIP (Package 402)*
Organized as two banks of 512Kx32, User
Congurable as 2Mx16 or 4Mx8
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
5V Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS1M32-XH2X - 13 grams (typical)
This product is subject to change without notice.
PIN DESCRIPTION
PIN CONFIGURATION FOR WS1M32-XH2X
A19
BLOCK DIAGRAM
TOP VIEW
I/O0-31
Data Inputs/Outputs
A0-19
Address Inputs
WE#1-4
Write Enables
CS#1-4
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
A19
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| WS1M32-25H2C | 1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 |
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| WS1M32V-25G3C | 1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP84 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS1M32-20HSC | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSCA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSI | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSIA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20HSM | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:1Mx32 SRAM MODULE |
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