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參數(shù)資料
| 型號(hào)： | WS128K32V-20G1UMA |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| 封裝： | 23.90 MM, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 9/9頁(yè) |
| 文件大?。?/td> | 330K |
| 代理商： | WS128K32V-20G1UMA |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G1U1 = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524)
ACCESS TIME (ns)
LOW VOLTAGE SUPPLY 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade. (H1 only)
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 128K 32 X V - XXX X X X
Note 1: Package Not Recommended For New Design
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32V-20G1TM | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WE128K32-200HC | 512K X 8 EEPROM 5V MODULE, 200 ns, HIP66 |
| WE128K32-300HM | 512K X 8 EEPROM 5V MODULE, 300 ns, HIP66 |
| WE128K32-300H1Q | 512K X 8 EEPROM 5V MODULE, 300 ns, HIP66 |
| WE32K32-90G2CA | 128K X 8 EEPROM 5V MODULE, 90 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32V-20G2TC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-20G2TCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-20G2TI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-20G2TIA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-20G2TM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
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