參數(shù)資料
型號(hào): WS128K32N-25H1M
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 6/9頁
文件大小: 546K
代理商: WS128K32N-25H1M
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
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參數(shù)描述
WS128K32N-25H1Q 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC
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WS128K32N-25HM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module
WS128K32N-25HQ 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module
WS128K32N-35G2TCE 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT