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參數(shù)資料
| 型號(hào)： | WS128K32-45H1I |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CHIP66 |
| 封裝： | HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 1/9頁(yè) |
| 文件大小： | 156K |
| 代理商： | WS128K32-45H1I |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
s Commercial, Industrial and Military Temperature
Ranges
s 5 Volt Power Supply
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Built in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
s Weight:
WS128K32-XG1UX - 5 grams typical
WS128K32-XG2TX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
s All devices are upgradeable to 512Kx32
FEATURES
s Access Times of 15, 17, 20, 25, 35, 45, 55ns
s MIL-STD-883 Compliant Devices Available
s Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400)
68 lead, 40mm CQFP (G4T), 3.56mm (0.140")
(Package 502).
68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),
(Package 509)
68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm
(0.140"), (Package 519)
s Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
s Low Power Data Retention - only available in G2T
package type
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
I/O8
I/O9
I/O10
A13
A14
A15
A16
NC
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
NC
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
TOP VIEW
BLOCK DIAGRAM
128K x 8
8
I/O 0-7
CS1
128K x 8
8
I/O 8-15
2
128K x 8
8
I/O 16-23
3
128K x 8
8
I/O 24-31
4
A 0-16
OE
WE
CS
WE
CS
WE
CS
WE
12
3
4
FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X
January 2001 Rev. 7
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