參數(shù)資料
型號(hào)： WS128K32-15G2UMA
廠商： MICROSEMI CORP-PMG MICROELECTRONICS
元件分類： SRAM
英文描述： 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68
封裝： 22.40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
文件頁(yè)數(shù)： 1/10頁(yè)
文件大小： 437K
代理商： WS128K32-15G2UMA
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
n
Commercial, Industrial and Military Temperature
Ranges
n
5 Volt Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
n
Weight:
WS128K32-XG1UX1 - 5 grams typical
WS128K32-XG1TX - 5 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX1 - 20 grams typical
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All devices are upgradeable to 512Kx32
Note 1: Package Not Recommended For New Design
FEATURES
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Access Times of 15, 17, 20, 25, 35, 45, 55ns
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MIL-STD-883 Compliant Devices Available
n
Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ce
ramic HIP (Package 400)
68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140")
(Package 502)
68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
68 lead, 22.4mm (0.880") square, CQFP (G2L),
5.08mm (0.200") high, (Package 528).
68 lead, 23.9mm Low Profile CQFP (G1U)1,
3.57mm (0.140"), (Package 519)
68 lead, 23.9mm Low Profile CQFP (G1T), 4.06
mm (0.160"), (Package 524)
n
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
FIG. 1
May 2003 Rev. 12
PIN CONFIGURATION FOR WS128K32N-XH1X
相關(guān)PDF資料
PDF描述
WS128K32-20G2UIA 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
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WS128K32-45G2UCA 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68
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