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參數(shù)資料
| 型號： | WF1M32B-100G2TM3 |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數(shù)： | 5/13頁 |
| 文件大小： | 159K |
| 代理商： | WF1M32B-100G2TM3 |
13
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
PROGRAMMING VOLTAGE
3 = 3.3V
DEVICE GRADE:
M = Military Screened
-55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H = Ceramic Hex In line Package, HIP (Package 401)
G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
W F 1M32 B - XXX X X 3 X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32N-20H1IA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| WS512K32N-55H1QA | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CHIP66 |
| WS512K32-20G4TQA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32L-15G2TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| WS512K32L-25G4TQ | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WF1M32B-100G2TM3A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-100G2TM5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100G2TM5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100G2UI3 | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 32Mbit 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS - Bulk |
| WF1M32B-100HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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