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參數(shù)資料
| 型號： | WEDPZ512K72V-150BI |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 72 ZBT SRAM, 3.8 ns, PBGA152 |
| 封裝： | 17 X 23 MM, PLASTIC, BGA-152 |
| 文件頁數(shù)： | 6/15頁 |
| 文件大小： | 0K |
| 代理商： | WEDPZ512K72V-150BI |
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White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WEDPZ512K72V-XBX
February 2009
Rev. 9
Document Title
512K x 72 Synchronous Pipeline Burst ZBL SRAM
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
May 2001
Advanced
Rev 1
Changes (Pg. 1)
1.1 Change status from Advanced to Preliminary
March 2001
Preliminary
Rev 2
Changes (Pg. 1, 2)
2.1 Block Diagram: Address lines should be A0-18
2.2 Pin Conguration: Add Note *Pin F8 reserved for A19
upgrade to 1Mx72.
March 2002
Preliminary
Rev 3
Changes (Pg. 1, 5)
3.1 BGA Capacitance: Remove references to temperature in
individual conditions
3.2 Change CI from 10pF to 8pF
3.3 Change CA from 20pF to 16pF
3.4 Change CCK from 7pF to 6pF
3.5 Add Control Input Capacitance (CIC) 16pF
November 2002
Preliminary
Rev 4
Changes (Pg. 5)
4.1 Add Thermal Resistance table
4.2 Update current values
4.3 Update package mechanical drawing
May 2003
Preliminary
Rev 5
Changes (Pg. 1, 5, 14)
5.1 Remove reference to Preliminary status
5.2 Add Maximum Operating Junction Temperature of 125°C
June 2003
Preliminary
Rev 6
Changes (Pg. 1, 13, 14)
6.1 Change mechanical drawing to new style
November 2003
Preliminary
Rev 7
Changes (Pg. 1, 5, 14)
7.1 Change VIL 3.3V ti 0.7V maximum
7.2 Change status to Final
February 2006
Final
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPZ512K72V-150BM | 制造商:White Electronic Designs 功能描述:SRAM Module Synchronous 36Mbit 制造商:Microsemi Corporation 功能描述:512K X 72 ZBL SSRAM MODULE, 3.3V, 150MHZ, 152 BGA 17MM X 23M - Bulk |
| WEDPZ512K72V-XBX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512K x 72 Synchronous Pipeline Burst ZBL SRAM |
| WEE-.1 | 制造商:FLORIDA MISC. 功能描述: |
| WEE.22 | 制造商:FLORIDA MISC. 功能描述: |
| WEE06 | 制造商:WILHELM SIHN JR 功能描述: |
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