參數(shù)資料
型號: WEDPS512K32LV-15BM
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143
封裝: 16 X 18 MM, PLASTIC, BGA-143
文件頁數(shù): 6/7頁
文件大?。?/td> 268K
代理商: WEDPS512K32LV-15BM
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPS512K32V-XBX
June 2004
Rev. 5
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
SRAM
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
OPTIONS:
L = Low power data retention
Low Voltage Supply 3.3V
± 10%
ACCESS TIME (ns)
PACKAGE TYPE:
B = 143 PBGA, 16mm x 18mm, 288mm2
DEVICE GRADE:
M = MILITARY SCREENED -55°C TO +125°C
I = INDUSTRIAL
-40°C TO 85°C
C = COMMERCIAL
0°C TO +70°C
WED P S 512K 32 L V - XX X X
相關(guān)PDF資料
PDF描述
WS128K32N-25H1CA 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66
WS128K32N-35H1M 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CHIP66
WE256K16-90CI5A 256K X 16 FLASH 5V PROM MODULE, 90 ns, CDMA40
WS512K32N-45H2IA 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CHMA66
WF512K32N-120H1I5A 512K X 32 FLASH 5V PROM MODULE, 120 ns, CHIP66
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WEDPS512K32LV-17BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-17BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-17BM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-20BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
WEDPS512K32LV-20BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE