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參數(shù)資料
| 型號： | WEDPS512K32-17BM |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁數(shù)： | 1/7頁 |
| 文件大?。?/td> | 235K |
| 代理商： | WEDPS512K32-17BM |
WEDPS512K32-XBX
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
November, 2003
Rev.6
512Kx32 SRAM MULTI-CHIP PACKAGE
FEATURES
Access Times of 12, 15, 17, 20, ns
Packaging
16mm x 18mm, 143 PBGA
Organized as 512Kx32, User Congurable as
1Mx16 or 2Mx8
PIN CONFIGURATION FOR WEDPS512K32-XBX
TOP VIEW
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE#1-4
Write Enables
CS#1-4
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
5V Power Supply
Low Power CMOS
This product is subject to change without notice.
512K x 8
8
I/O0-7
WE#1 CS#1
512K x 8
8
I/O8-15
WE#2 CS#2
512K x 8
8
I/O16-23
WE#3 CS#3
512K x 8
8
I/O24-31
WE#4 CS#4
A0-18
OE#
BLOCK DIAGRAM
12
34
5
6
7
89
10
11
12
A
-
A2A1
A0GND
GND
VCC
A18
A17
A16
GND
B
CS#2
A3
A4
D14
D15
NC
CS#4
D24
D25
OE#
A15
NC
C
D9
D8
NC
D12
D13
GND
VCC
D26
D27
WE#4
D31
D30
D
D10
D11
GND
VCC
D28
D29
E
WE#2
GND
VCC
NC
F
GND
VCC
G
VCC
GND
H
CS#1
VCC
GND
NC
J
D1
D0
VCC
GND
D23
D22
K
D2
D3
NC
D7
D5
VCC
GND
D17
D16
CS#3
D20
D21
L
WE#1
A6
A5
D6
D4
NC
WE#3
D19
D18
A14
A13
NC
M
GND
A7
A8
A9
VCC
GND
A10
A11
A12
VCC
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