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參數(shù)資料
| 型號： | WEDPN16M72VR-125BC |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 16M X 72 SYNCHRONOUS DRAM MODULE, 5.8 ns, PBGA219 |
| 封裝： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 161K |
| 代理商： | WEDPN16M72VR-125BC |
WEDPN16M72VR-XBX
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
12
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
BOTTOM VIEW
*133MHz available in commercial and industrial temperatures only
32.1 (1.264) MAX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
25.1 (0.988)
MAX
19.05 (0.750)
NOM
1.27 (0.050)
NOM
19.05 (0.750) NOM
2.03 (0.080)
MAX
0.61 (0.024) NOM
219 x 0.762 (0.030) NOM
WED P N 16M 72 V R - XXX B X
WHITE ELECTRONIC DESIGNS CORP.
PLASTIC
SDRAM
CONFIGURATION, 16M x 72
3.3V Power Supply
IMPROVEMENT MARK:
R = Registered
FREQUENCY (MHz)
133 = 133MHz*
125 = 125MHz
100 = 100MHz
66 = 66MHz
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPN16M72VR-133B2C | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16MX72 REGISTERED SYNCHRONOUS DRAM |
| WEDPN16M72VR-133B2I | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16MX72 REGISTERED SYNCHRONOUS DRAM |
| WEDPN16M72VR-133B2M | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:16MX72 REGISTERED SYNCHRONOUS DRAM |
| WEDPN16M72VR-66BC | 制造商:Microsemi Corporation 功能描述:16M X 72 SDRAM MODULE W/REGISTERED BUFFERS, 3.3V, 66 MHZ, 21 - Bulk |
| WEDPN16M72VR-66BI | 制造商:Microsemi Corporation 功能描述:16M X 72 SDRAM MODULE W/REGISTERED BUFFERS, 3.3V, 66 MHZ, 21 - Bulk |
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