參數(shù)資料
型號: WED2DL36514AV40BI
元件分類: SRAM
英文描述: 512K X 36 STANDARD SRAM, 4 ns, PBGA119
封裝: PLASTIC, BGA-119
文件頁數(shù): 8/12頁
文件大?。?/td> 266K
代理商: WED2DL36514AV40BI
5
White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com
WED2DL36513V
WED2DL36513AV
AC CHARACTERISTICS (WED2DL36513V)
Symbol
200MHz
166MHz
150MHz
133MHz
Parameter
Min
Max
Min
Max
Min
Max
Min
Max
Units
Clock
Clock Cycle Time
tKC
5.0
6.0
6.6
7.5
ns
Clock Frequency
tKF
200
166
150
133
MHz
Clock HIGH Time
tKH
2.0
2.4
2.6
ns
Clock LOW Time
tKL
2.0
2.4
2.6
ns
Output Times
Clock to output valid
tKQ
2.5
3.5
3.8
4.0
ns
Clock to output invalid (2)
tKQX
1.5
1.25
1.5
ns
Clock to output on Low-Z (2,3,4)
tKQLZ
00
0
ns
Clock to output in High-Z (2,3,4)
tKQHZ
3.0
3.5
3.8
4.0
ns
OE to output valid (5)
tOEQ
2.5
3.5
3.8
4.0
ns
OE to output in Low-Z (2,3,4)
tOELZ
00
0
ns
OE to output in High Z (2,3,4)
tOEHZ
2.5
3.5
3.8
4.0
ns
Setup Times
Address (6,7)
tAS
1.5
ns
Address status (ADSC, ADSP) (6,7)
tADSS
1.5
ns
Address advance (ADV) (6,7)
tAAS
1.5
ns
Write signals (BWa-BWd, BWE, GW) (6,7)
tWS
1.5
ns
Data-in (6,7)
tDS
1.5
ns
Chip enables (CE, CE2, CE2) (6,7)
tCES
1.5
ns
Hold Times
Address (6,7)
tAH
0.5
ns
Address status (ADSC, ADSP) (6,7)
tADSH
0.5
ns
Address advance (ADV) (6,7)
tAAH
0.5
ns
Write Signals (BWa-BWd, BWE, GW) (6,7)
tWH
0.5
ns
Data-in (6,7)
tDH
0.5
ns
Chip Enables (CE, CE2, CE2) (6,7)
tCEH
0.5
ns
NOTES:
1. Test conditions as specified with the output loading as shown in Figure 1 for 3.3V 1/0 and Figure 3 for 2.5V 1/0 unless otherwise noted.
2. This parameter is measured with output load as shown in Figure 2 for 3.3V 1/0 and Figure 4 for 2.5V 1/0.
3. This parameter is sampled.
4. Transition is measured
±500mV from steady state voltage.
5. OE is a “Don’t Care” when a byte write enable is sampled LOW.
6. A WRITE cycle is defined by at least one byte write enable LOW and ADSP HIGH for the required setup and hold times. A READ cycle Is defined by all
byte write enables HIGH and ADSC or ADV LOW or ADSP LOW for the required setup and hold times.
7. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK when either ADSP or ADSC is LOW
and chip enabled. All other synchronous inputs must meet the setup and hold times with stable logic levels for all rising edges of clock (CLK) when the
chip is enabled. Chip enable must be valid at each rising edge of CLK when either ADSP or ADSC is LOW to remain enabled.
OUTPUT LOADS
AC TEST CONDITIONS
50
Vt = 1.5V
Output
Z0 = 50
Z0 = 50
Parameter
3.3V I/O
2.5V I/O
Unit
Input Pulse Levels
VSS to 3.0
VSS to 2.5
V
Input Rise and Fall Times
1
ns
Input Timing Reference Levels
1.5
1.25
V
Output Timing Reference Levels
1.5
1.25
V
Output Load
See figure, at left
AC Output Load Equivalent
Vt = 1.5V for 3.3V I/O
Vt = 1.25V for 2.5V I/O
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