| 型號(hào): | W764M32V100SBI |
| 廠商: | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類: | PROM |
| 英文描述: | 64M X 32 FLASH 3V PROM, 100 ns, PBGA107 |
| 封裝: | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件頁數(shù): | 1/16頁 |
| 文件大?。?/td> | 511K |
| 代理商: | W764M32V100SBI |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W7NCF02GH10CS3DM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF02GH10CSA4HM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF02GH10CSBBM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF02GH10IS3JM1G | FLASH 3.3V PROM MODULE, XMA50 |
| W7NCF02GH10ISA8DM1G | FLASH 3.3V PROM MODULE, XMA50 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W764M32V100SBI/T/R-C50700 | 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
| W764M32V100SBM | 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, MEMORY, FLASH, 64M X 32 - Bulk |
| W764M32V120SB | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |