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參數(shù)資料
| 型號： | W72M64V-100BI |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封裝： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件頁數(shù)： | 15/15頁 |
| 文件大?。?/td> | 160K |
| 代理商： | W72M64V-100BI |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
FIG 8: CHIP/SECTOR ERASE OPERATION TIMINGS
Notes:
1.
SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data
FIG 7: ACCELERATED PROGRAM TIMING DIAGRAM
VHH
tVHH
VIL or VIH
WP/ACC
VIL or VIH
Addresses
CS
OE
WE
Data
RY/BY
VCC
2AAh
SA
VA
tWC
tAH
tWHWH2
30h
In
Progress
Complete
55h
tBUSY
VA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
10 for Chip Erase
555h for
chip erase
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W72M64VK100BI | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| W78M64110SBM | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64110SBI | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64120SBI | 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159 |
| W78M64110SBC | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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