- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄245702 > W3E32M64S-333SBM (WHITE ELECTRONIC DESIGNS CORP) 32M X 64 DDR DRAM, 0.7 ns, PBGA208 PDF資料下載
參數(shù)資料
| 型號： | W3E32M64S-333SBM |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.7 ns, PBGA208 |
| 封裝： | 13 X 22 MM, PLASTIC, BGA-208 |
| 文件頁數(shù)： | 10/18頁 |
| 文件大小： | 648K |
| 代理商： | W3E32M64S-333SBM |
18
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E32M64S-XSBX
January 2008
Rev. 6
Document Title
32M x 64 DDR SDRAM Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 6
Changes (Pg. 1, 7, 15, 17)
6.1 Update package thickness to match Mechanical Outline
6.2 Add CAS Latency of 3 to Figure 3
January 2008
Final
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3EG7217S262D3F | 16M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
| W78M64VP110SBC | SPECIALTY MEMORY CIRCUIT, PBGA156 |
| W7NCF512H11CS6BG | 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF512H11IS9CG | 32M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| WE128K32-150G2Q | 128K X 32 EEPROM 5V MODULE, 150 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3E32M64SA-200BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64SA-200BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64SA-200BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64SA-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64SA-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。