參數(shù)資料
型號: W332M64V-100BM
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 32M X 64 SYNCHRONOUS DRAM, 7 ns, PBGA219
封裝: 25 X 25 MM, PLASTIC, BGA-219
文件頁數(shù): 15/15頁
文件大?。?/td> 351K
代理商: W332M64V-100BM
9
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W332M64V-XBX
October 2006
Rev. 1
ABSOLUTE MAXIMUM RATINGS
Parameter
Unit
Voltage on VCC, VCCQ Supply relative to Vss
-1 to 4.6
V
Voltage on NC or I/O pins relative to Vss
-1 to 4.6
V
Operating Temperature TA (Mil)
-55 to +125
°C
Operating Temperature TA (Ind)
-40 to +85
°C
Storage Temperature, Plastic
-55 to +125
°C
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specication is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 2)
Parameter
Symbol
Max
Unit
Input Capacitance: CLK
CI1
8
pF
Addresses, BA0-1 Input Capacitance
CA
22
pF
Input Capacitance: All other input-only pins
CI2
10
pF
Input/Output Capacitance: I/Os
CIO
10
pF
BGA THERMAL RESISTANCE
Description
Symbol
Max
Unit
Notes
Junction to Ambient (No Airow)
Theta JA
14.4
C/W
1
Junction to Ball
Theta JB
10.0
C/W
1
Junction to Case (Top)
Theta JC
5.2
C/W
1
NOTE:
Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the application notes section for modeling conditions.
specified for the clock pin) prior to CKE going back
HIGH. Once CKE is HIGH, the SDRAM must have NOP
commands issued (a minimum of two clocks) for tXSR,
because time is required for the completion of any internal
refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH
commands must be issued as both SELF REFRESH and
AUTO REFRESH utilize the row refresh counter.
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