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參數(shù)資料
| 型號(hào)： | W2Z1M72SJ28BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 1M X 72 MULTI DEVICE SRAM MODULE, 2.8 ns, PBGA209 |
| 封裝： | PLASTIC, BGA-209 |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大?。?/td> | 624K |
| 代理商： | W2Z1M72SJ28BC |
12
White Electronic Designs Corporation Westborough, MA (508) 366-
5151
W2Z1M72SJ
PACKAGE DIMENSION: 209 BUMP PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
2.50 (0.099)
MAX
0.600 (0.024)
MAX
1.27 (0.050)
TYP
1.00 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
14.00 (0.551) TYP
A1
CORNER
18.00
TYP
22.00 (0.866)
TYP
10.00 (0.394)
TYP
R 1.52 (0.060)
MAX (4x)
11 10
9
8
7
654
32
1
ORDERING INFORMATION
Commercial Temp Range (0°C to 70°C), Industrial Temp. Range (-40° to 85°C)
Part Number
Configuration
tCD
Clock
Operating
(ns)
(MHz)
Range
W2Z1M72SJ35ES
1M x 72
3.5
166
Engineering Samples
W2Z1M72SJ38ES
1M x 72
3.8
150
Engineering Samples
W2Z1M72SJ28BC
1M x 72
2.8
225
Commercial
W2Z1M72SJ30BC
1M x 72
3.0
200
Commercial
W2Z1M72SJ35BC
1M x 72
3.5
166
Commercial
W2Z1M72SJ38BC
1M x 72
3.8
150
Commercial
W2Z1M72SJ30BI
1M x 72
3.0
200
Industrial
W2Z1M72SJ35BI
1M x 72
3.5
166
Industrial
W2Z1M72SJ38BI
1M x 72
3.8
150
Industrial
NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.
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