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參數(shù)資料
| 型號(hào)： | W27L01-70 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 128K X 8 EEPROM 12V, 70 ns, PDIP32 |
| 封裝： | 0.600 INCH, PLASTIC, DIP-32 |
| 文件頁(yè)數(shù)： | 5/15頁(yè) |
| 文件大?。?/td> | 258K |
| 代理商： | W27L01-70 |
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W27L01
Publication Release Date: May 31, 2002
- 13 -
Revision A2
18. PACKAGE DIMENSIONS
32-pin P-DIP
Seating Plane
eA
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
32
1
16
17
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
Notes:
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
1.37
1.22
0.054
0.048
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
B
c
D
e
A
L
S
A
1
2
E
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.555
0.550
13.84
14.10
13.97
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
B 1
1
e
E1
a
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
15
0
32-Lead PLCC
L
c
1
b
2
A
H
E
e
b
D
H
D
y
A
1
Seating Plane
E
G
D
1
13
14
20
29
32
4
5
21
30
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on
final
visual inspection sepc.
θ
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
b
c
D
e
HE
L
y
A
1
2
E
b 1
G D
3.56
0.50
HD
G E
0.020
0.140
2.80
2.67
2.93
0.71
0.66
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45
12.95
13.46
0.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.032
0.026
0.028
0.115
0.105
0.110
1.12
1.42
0.044
0.056
0°
10°
0°
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.10
2.41
θ
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W27L01P-70 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 ELECTRICALLY ERASABLE EPROM |
| W27L01P-90 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 ELECTRICALLY ERASABLE EPROM |
| W27L01Q-70 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 ELECTRICALLY ERASABLE EPROM |
| W27L01Q-90 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 ELECTRICALLY ERASABLE EPROM |
| W27L01T-70 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:128K X 8 ELECTRICALLY ERASABLE EPROM |
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