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參數(shù)資料
| 型號： | VSM0805RBSW |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| 中文描述： | 散裝金屬箔表面貼裝技術(shù)的離散芯片電阻 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 66K |
| 代理商： | VSM0805RBSW |
For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
www.vishay.com
23
VSM0805
Vishay Foil Resistors
Document Number: 63061
Revision 17-Aug-04
S
ISRAEL: foilsales.israel@vishay.com FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com AMERICAS: foilsales.usa@vishay.com
ASIA/JAPAN: foilsales.asia@vishay.com UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
SALES
Bulk Metal
Foil Technology
Discrete Surface Mount Chip Resistors
MODEL
CHIP SIZE
RESISTANCE VALUE
TOLERANCE TERMINATION
PACKAGING
VSM
0805
RESISTANCE
RANGE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
T
±
0.01%
Q
±
0.02%
A
±
0.05%
B
±
0.1%
C
±
0.25%
D
±
0.5%
F
±
1.0%
S
- Lead (Pb)-free
B
- Tin/Lead
T = Tape and
Reel
W = Waffle
PacK
5
to <1K
R
x 1.0
Example: 249R00 = 249
T
W
L
D
T
W
L
1K to 12K
K
x 10
3
Example: 10K000 = 10.0K
FIGURE 3 - RECOMMENDED MOUNTING
CHIP
SIZE
POWER
MAXIMUM
RESISTANCE
MAXIMUM
+ 70
°
C
VOLTAGE
(mW)
(V)
L
W
T
D
RANGE
(
)
WEIGHT
(mG)
Z*
G*
X*
±
0.005 (0.13)
±
0.005 (0.13) MAXIMUM
±
0.005 (0.13)
±
0.004 (0.10)
±
0.004 (0.10)
±
0.004 (0.10)
0805
0.080 (2.03)
0.050 (1.27) 0.025 (0.64) 0.015 (0.38)
50
22
5.5 - 12K
6
0.122 (3.10)
0.028 (0.70)
0.050 (1.27)
*Land Pattern Dimensions (Z, G, X) are per IPC-782A
TABLE 3 - CHIP SIZES AND SPECIFICATIONS
in inches (millimeters)
TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS
FIGURE 2 - POWER DERATING CURVE
125
100
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (
°
C)
P
–55
°
C
+70
°
C
Rated Power
Footprint
G
Z
X
Top View
Bottom View
Recommended Land Pattern
25% to 85% of T
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| VSM0805RCBT | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RDBT | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RDBW | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RDST | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RDSW | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| VSM0805RCBT | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RCBW | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RCST | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RCSW | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| VSM0805RDBT | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
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