參數(shù)資料
型號: V324IP
廠商: 意法半導(dǎo)體
元件分類: 運(yùn)算放大器
英文描述: General Purpose, Input/Output Rail-to-Rail Low Power Operational Amplifiers
中文描述: 通用,輸入/輸出軌至軌低功耗運(yùn)算放大器
文件頁數(shù): 9/15頁
文件大小: 225K
代理商: V324IP
TSV321-TSV358-TSV324
Package Mechanical Data
9/15
4
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
www.st.com
.
4.1
SO-8 Package
DIM.
mm.
inch
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.04
0.010
A2
1.10
1.65
0.043
0.065
B
0.33
0.51
0.013
0.020
C
0.19
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
e
1.27
0.050
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
(max.)
8
ddd
0.1
0.04
SO-8 MECHANICAL DATA
0016023/C
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