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參數(shù)資料
| 型號： | V23816-N1018-C312 |
| 廠商： | SIEMENS AG |
| 英文描述： | 3.3 V, 4-Line LVDS Parallel 2.5 GBd Transponder(3.3V, 4線低壓差分信號并行2.5 GBd異頻雷達(dá)收發(fā)器) |
| 中文描述： | 3.3伏，四線并行的LVDS 2.5 GBd轉(zhuǎn)發(fā)器（3.3V，四線低壓差分信號并行2.5 GBd異頻雷達(dá)收發(fā)器） |
| 文件頁數(shù)： | 12/12頁 |
| 文件大小： | 2303K |
| 代理商： | V23816-N1018-C312 |
Published by Infineon Technologies AG
Infineon Technologies AG 2000
All Rights Reserved
Attention please!
The information herein is given to describe certain components and shall not be
considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties
of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices
please contact the Infineon Technologies offices or our Infineon Technologies
Representatives worldwide - see our webpage at
www.infineon.com/fiberoptics
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your Infineon Technologies
offices.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the
human body, or to support and/or maintain and sustain and/or protect human life.
If they fail, it is reasonable to assume that the health of the user or other persons
may be endangered.
Infineon Technologies AG
Fiber Optics
Wernerwerkdamm 16
Berlin D-13623, Germany
Infineon Technologies, Inc.
Fiber Optics
1730 North First Street
San J ose, CA 95112, USA
Infineon Technologies K.K.
Fiber Optics
Takanawa Park Tower
20-14, Higashi-Gotanda, 3-chome, Shinagawa-ku
Tokyo 141, J apan
Hostboard Contact Area
For the guaranteed EMI-performance an optimal electrical con-
tact between the transponder housing and the user's pcb sig-
nal ground is necessary. For the user's pcb (hostboard) we
recommend a full signal ground plane underneath the entire
transponder housing (including the standoff area, the EMI gas-
ket area and the optional heatsink area).
The transponder is equipped with an attached EMI gasket.
According to the drawing
“
Hostboard Contact Area
”
the con-
tact surface of the entire EMI gasket should be connected to
signal ground on the user's pcb. The area under the EMI gas-
kets (EMI gasket area) should be gold flash or tin plated copper
with no solder mask or other nonconductive coatings.
The four mounting screws of the housing also must be con-
nected to signal ground on the user's pcb. Therefore the
mounting screw areas should have square pads of gold flash or
tin plated copper, that are connected to signal ground. These
pads are located on the pcb opposite side to the transponder.
Use a torque wrench to tighten the mounting screws. The rec-
ommended torque value is 10
±
2 Ncm = 0.1
±
0.02 Nm =
14.16
±
2.83 oz-in. With a higher or lower value, the EMI-perfor-
mance will deteriorate.
The heatsink area under the center of the transponder is
optional and could be used for critical ambient temperature or
critical airflow. Currently it is not a complete replacement for
the regular heatsink. The contact area should be connected to
signal ground. Gold (Au), Tin or other metal platings are recom-
mended for good heat transfer. Any polymer coating will
decrease the heatsinking performance. Special heat transfer
pads are in progress. For reliable heatsinking to the hostboard,
the max. hostboard temperature must be lower or equal to the
specified ambient air temperature.
Dimensions in mm [inches]
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相關(guān)代理商/技術(shù)參數(shù) |
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