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參數(shù)資料
| 型號(hào)： | V14MLN41206 |
| 廠商： | Littelfuse, Inc. |
| 英文描述： | Multiline Transient Voltage Surge Suppressor |
| 中文描述： | 多行瞬態(tài)電壓浪涌抑制器 |
| 文件頁數(shù)： | 5/7頁 |
| 文件大小： | 170K |
| 代理商： | V14MLN41206 |
Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) Reflow, Vapour Phase Reflow, and
Wave Soldering.Typical profiles are shown in Figures 12, 13 and 14.
When wave soldering, the MLN suppressor is attached to the circuit
board by means of an adhesive.The assembly is then placed on a con-
veyor and run through the soldering process to contact the wave. With IR
and Vapour Phase Reflow, the device is placed in a solder paste on the
substrate. As the solder paste is heated, it reflows and solders the unit to
the board.
The recommended solder for the MLN suppressor is a 62/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled.
Typical Performance Curves
Any Single Section (Continued)
10000
FIGURE 10. IMPEDANCE vs FREQUENCY
FIGURE 11. ADJACENT CHANNEL CROSSTALK
1000
100
10
1
0.1
1MHz
10MHz
100MHz
1GHz
10GHz
FREQUENCY
I
0
-20
-40
-60
-80
-100
-120
1kHz
100kHz
10kHz
1MHz
10MHz
100MHz
1GHz
FREQUENCY
C
V
IN
= 1V
RMS
Z = 50
When using a reflow process, care should be taken to ensure that the
MLN chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solders peak
temperature is essential to minimize thermal shock. Examples of the sol-
dering conditions for the MLN array of suppressors are given in the
tables below.
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause of
thermal shock is hot printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room temperature.The
boards must be allowed to gradually cool to less than 50
o
C before cleaning.
MLN SurgeArray
Suppressor
Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
155
www.littelfuse.com
3
S
V
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| V14MLN41206WA | 功能描述:MULTI LAYER MULTI LINE VARISTOR RoHS:否 類別:過電壓，電流，溫度裝置 >> TVS - 變阻器，MOV 系列:MLN 標(biāo)準(zhǔn)包裝:250 系列:- 變阻器電壓:750V 電流 - 浪涌:1.2kA 電路數(shù):1 最大交流電壓:460VAC 最大直流電壓:615VDC 能量:63J 封裝/外殼:圓盤 9mm 其它名稱:2322 593 54616232259354616BC1419VDRS07H460BSC |
| V14MLN41206WH | 功能描述:壓敏電阻 10V 150A 140pF RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V14P11P | 功能描述:壓敏電阻 11Vrms 4kA 18870pF 14mm Disc RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V14P14P | 功能描述:壓敏電阻 14Vrms 4kA 14730pF 14mm Disc RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V14P150 | 功能描述:壓敏電阻 150Vrms 160pF 14mm Disc RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
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