參數(shù)資料
型號(hào): UPD784915AGF
廠商: NEC Corp.
英文描述: 16-BIT SINGLE-CHIP MICROCONTROLLERS
中文描述: 16位單晶片微控制器
文件頁(yè)數(shù): 78/86頁(yè)
文件大?。?/td> 446K
代理商: UPD784915AGF
μ
PD784915A, 784916A
78
8. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
μ
PD784915A and 784916A.
For details of the recommended soldering conditions, refer to the NEC document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 18-1. Soldering Conditions for Surface-Mount Type
μ
PD784915AGF-
×××
-3BA :
μ
PD784916AGF-
×××
-3BA :
100-pin plastic QFP (14
×
20 mm)
100-pin plastic QFP (14
×
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Duration: 30 sec. max.
(at 210
°
C or above), Number of times: 3 max.
IR35-00-3
VPS
Package peak temperature: 215
°
C, Duration: 40 sec. max.
(at 200
°
C or above), Number of times: 3 max.
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C max. Duration: 10 sec. max.
Number of times: 1
Preliminary heat temperature: 120
°
C max.
(Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max.,
Duration: 3 sec. max. (per device side)
Caution
Using more than one soldering method should be avoided (except in the case of partial heating).
相關(guān)PDF資料
PDF描述
UPD784916A 16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784916AGF 16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784915B 16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784915BGF 16-BIT SINGLE-CHIP MICROCONTROLLERS
UPD784916B 16-BIT SINGLE-CHIP MICROCONTROLLERS
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