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參數(shù)資料
| 型號： | UPD720130GC-9EU-SIN |
| 廠商： | NEC Corp. |
| 英文描述： | USB2.0 to IDE Bridge |
| 中文描述： | USB2.0轉(zhuǎn)IDE橋 |
| 文件頁數(shù)： | 39/44頁 |
| 文件大?。?/td> | 316K |
| 代理商： | UPD720130GC-9EU-SIN |
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Data Sheet S16302EJ3V0DS
39
μ
PD720130
5.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD720130 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact your NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
PD720130GC-9EU:
100-pin plastic TQFP (Fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds or less (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
μ
PD720130GC-9EU-SIN: 100-pin plastic TQFP (Fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds or less (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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