參數(shù)資料
型號(hào)： UPD720130
廠商： NEC Corp.
英文描述： USB2.0 to IDE Bridge
中文描述： USB2.0轉(zhuǎn)IDE橋
文件頁(yè)數(shù)： 39/44頁(yè)
文件大?。?/td> 316K
代理商： UPD720130
Data Sheet S16302EJ3V0DS
39
μ
PD720130
5.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD720130 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact your NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
PD720130GC-9EU:
100-pin plastic TQFP (Fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds or less (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
μ
PD720130GC-9EU-SIN: 100-pin plastic TQFP (Fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds or less (per pin row)
–
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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