
μ
PD6125A, 6126A
34
24. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD6125A and 6126A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For other soldering methods and conditions, consult NEC.
Table 24-1. Surface-Mount Type Soldering Conditions
(1)
μ
PD6125AG-XXX: 24-pin plastic SOP (300 mil)
Symbol for
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 230
°
C, time: 30 seconds max. (210
°
C min.),
number of times: 1
IR30-00-1
VPS
Package peak temperature: 215
°
C, time: 40 seconds max. (200
°
C min.),
number of times: 1
VP15-00-1
Partial heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per device side)
–
(2)
μ
PD6126AG-XXX: 28-pin plastic SOP (375 mil)
Symbol for
Recommended
Condition
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 230
°
C, time: 30 seconds max. (210
°
C min.),
number of times: 1
IR30-00-1
VPS
Package peak temperature: 215
°
C, time: 40 seconds max. (200
°
C min.),
number of times: 1
VP15-00-1
Wave soldering
Solder bath temperature: 260
°
C max., time: 10 seconds max., number of times: 1
Pre-heating temperature: 120
°
C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per device side)
–
Caution
Use more than one soldering method should be avoided (except in the case of partial heating).
Table 24-2. Insertion Type Soldering Conditions
μ
PD6125ACA-XXX: 24-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave soldering (Only for pin)
Solder bath temperature: 260
°
C max., time: 10 seconds max.
Partial heating
Pin temperature: 300
°
C max., time: 3 seconds max. (per pin)
Caution
Wave soldering is only for pins in order that jet solder can not contact with the chip directly.