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參數(shù)資料
| 型號(hào)： | UPD4723GS-GJG |
| 廠商： | NEC Corp. |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | Low Power 5V RS232 Dual Driver/Receiver with 0.1?μF Capacitors; Package: SO; No of Pins: 16; Temperature Range: -40?°C to 85?°C |
| 中文描述： | 電可擦除可編程邏輯器件 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大小： | 125K |
| 代理商： | UPD4723GS-GJG |
μ
PD4723
13
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
offices in case other soldering process is used, or in case soldering is done under different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SMT MANUAL” (C10535E).
μ
PD4723GS-GJG
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldring conditions
Peak package’s surface temperature: 230
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 40 seconds or below (200
°
C or higher),
Number of reflow process: 2,
Exposure limit
*
: None
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or below,
Number of flow process: 1,
Exposure limit
*
: None
Terminal temperature: 300
°
C or below,
Flow time: 10 seconds or below,
Exposure limit
*
: None
Symbol
IR30-00-2
VP15-00-2
WS60-00-1
*
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Note
Do not apply more than a single process at once, except for “Partial heating method”.
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