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參數(shù)資料
| 型號(hào)： | UPD178006AGC |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-BIT SINGLE-CHIP MICROCONTROLLERS |
| 中文描述： | 8位單晶片微控制器 |
| 文件頁數(shù)： | 47/56頁 |
| 文件大?。?/td> | 314K |
| 代理商： | UPD178006AGC |
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47
μ
PD178004A, 178006A, 178016A, 178018A
12. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
μ
PD178004AGC-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
μ
PD178006AGC-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
μ
PD178016AGC-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
μ
PD178018AGC-
×××
-3B9 : 80-pin plastic QFP (14
×
14 mm, 0.65 mm pitch)
Package peak temperature: 235
°
C, Duration: 30 sec. max. (at 210
°
C or above),
Number of times: Three times max.
Package peak temperature: 215
°
C, Duration: 40 sec. max. (at 200
°
C or above),
Number of times: Three times max.
Solder bath temperature : 260
°
C max., Duration : 10 sec. max., Number of times
: once, Preheating temperature : 120
°
C max.
(package surface temperature)
Pin temperature: 300
°
C max. Duration: 3 sec. max. (per pin row)
Infrared reflow
VPS
Wave soldering
Partial heating
IR35-00-3
VP15-00-3
WS60-00-1
—
Recommended
Condition Symbol
Soldering Conditions
Soldering Method
Caution Do not use different soldering method together (except for partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD178006AGC-XXX-3B9 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8-Bit Microcontroller |
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