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參數(shù)資料
| 型號： | UPD168117AFC-BA2-E1-A |
| 廠商： | NEC Corp. |
| 英文描述： | 7-CHANNEL H-BRIDGE DRIVER WITH A MICRO STEP FUNCTION SUPPORTING PULSE INPUT |
| 中文描述： | 7通道H -橋甲微步支脈沖輸入功能驅(qū)動程序 |
| 文件頁數(shù)： | 22/24頁 |
| 文件大小： | 275K |
| 代理商： | UPD168117AFC-BA2-E1-A |
Data Sheet S17486EJ1V0DS
22
μ
PD168117A
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD168117A should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
μ
PD168117AFC-BA2-E1-A
Note1
: 64-pin plastic FLGA (6 x 6)
Process
Conditions
Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds MAX. (at 220
°
C or higher) ,
Count: Three times or less, Exposure limit: 3 days
Note2
(after that, prebake at 125
°
C
for 10 hours) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Precaution>
Products other than in heat-resistant trays (such as those packaged in a magazine,
taping, or non-thermal-resistant tray) cannot be baked in their package.
IR60-103-3
Notes 1.
Pb-free (This product does not contain Pb in external electrode and other parts.)
2.
After opening the dry pack, store it a 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating) .
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