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參數(shù)資料
| 型號(hào)： | UPD168110MA-6A5 |
| 廠商： | NEC Corp. |
| 英文描述： | MICROSTEP DRIVER FOR DRIVING CAMERA LENS |
| 中文描述： | 微步驅(qū)動(dòng)驅(qū)動(dòng)光圈鏡頭 |
| 文件頁(yè)數(shù)： | 17/18頁(yè) |
| 文件大?。?/td> | 200K |
| 代理商： | UPD168110MA-6A5 |
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Data Sheet S15840EJ2V0DS
17
μ
PD168110
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD168110 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Recommended Soldering Conditions for Surface Mounting Type
μ
PD168110MA-6A5 24pin TSSOP
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 60 seconds max. (at 220°C or
higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with
low chlorine (0.2 Wt% or below) recommended
IR60-00-3
Caution Do not use different soldering methods together (except for partial heating).
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