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參數(shù)資料
| 型號(hào)： | UPD16808GS |
| 廠商： | NEC Corp. |
| 英文描述： | MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT |
| 中文描述： | 整體式雙H橋驅(qū)動(dòng)電路 |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大小： | 96K |
| 代理商： | UPD16808GS |
μ
PD16808
10
RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the conditions described below.
For soldering methods and conditions other than those listed below, consult NEC.
Surface mount type
For the details of the recommended soldering conditions of this type, refer to
Semiconductor Device Mounting
Technology Manual (C10535E)
.
Soldering Method
Soldering Conditions
Symbol of Recommended
Soldering
Infrared reflow
Peak package temperature: 230
°
C, Time: 30 seconds MAX. (210
°
C MIN.),
Number of times: 1, Number of days: None
Note
IR30-00
VPS
Peak package temperature: 215
°
C, Time: 40 seconds MAX. (200
°
C MIN.),
Number of times: 1, Number of days: None
Note
VP15-00
Wave soldering
Solder bath temperature: 260
°
C MAX., Time: 10 seconds MAX.,
Number of times: 1, Number of days: None
Note
WS60-00
Partial heating
Pin temperature: 300
°
C MAX., Time: 10 seconds MAX.,
Number of days: None
Note
–
Note
The number of storage days at 25
°
C, 65 % RH after the dry pack has been opened
Caution Do not use two or more soldering methods in combination (except partial heating).
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