參數資料
型號: UPD16650N-XXX
廠商: NEC Corp.
英文描述: Interface IC
中文描述: 接口IC
文件頁數: 11/12頁
文件大?。?/td> 62K
代理商: UPD16650N-XXX
μ
PD16650
11
RECOMMENDED MOUNTING CONDITIONS
When mounting this product, please make sure that the following recommended conditions are satisfied.
For packaging methods and conditions other than those recommended below, please contact NEC sales
personnel.
μ
PD16650N-
×××
Mounting Condition
Mounting Method
Thermocompression
Soldering
ACF (Sheet-shape bonding
agent)
Caution
To find out the detailed conditions for packaging the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more packaging methods at a time.
Reference
NEC Semiconductor Device Reliability/Quality Control System (IEI-1212)
Quality Grades to NEC’s Semiconductor Devices (IEI-1209)
Condition
Heating tool 300 to 350 C; heating for 2 to 3 seconds; pressure 100 g
(per solder)
Temporary bonding 70 to 100 C; pressure 3 to 8 kg/cm
2
; time 3 to 5
secs.
Real bonding 165 to 180 C; pressure 25 to 45 kg/cm
2
; time 30 to 40
secs. (when using the anisotropic conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
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