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參數(shù)資料
| 型號： | UPD16520 |
| 廠商： | NEC Corp. |
| 英文描述： | VERTICAL DRIVER FOR CCD SENSORS |
| 中文描述： | 垂直驅(qū)動CCD傳感器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 100K |
| 代理商： | UPD16520 |
14
μ
PD16520
Data Sheet S14201EJ1V0DS00
6. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD16520 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 6-1. Surface Mounting Type Soldering Conditions
μ
PD16520GS-BGG: 38-pin plastic shrink SOP (300 mil)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
IR35-00-3
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max. (at 210
°
C or higher),
Count: Three times or less
Package peak temperature: 215
°
C, Time: 40 sec. Max. (at 200
°
C or higher),
Count: Three times or less
Solder bath temperature: 260
°
C, Time: 10 sec. Max., Count: Once,
Preheating temperature: 120
°
C Max. (package surface temperature)
Pin temperature: 300
°
C Max., Time: 3 sec. Max. (per pin row)
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating
Caution
Do not use different soldering methods together (except for partial heating).
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