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參數(shù)資料
| 型號： | UPC8139GR-7JH-E1 |
| 廠商： | NEC Corp. |
| 英文描述： | DIODE ZENER SINGLE 350mW 6Vz 20mA-Izt 0.05 5uA-Ir 3.5 SOT-23 3K/REEL |
| 中文描述： | 單芯片收發(fā)器的硅單片小靈通 |
| 文件頁數(shù)： | 19/20頁 |
| 文件大小： | 223K |
| 代理商： | UPC8139GR-7JH-E1 |
Preliminary Data Sheet
19
μ
PC8139GR-7JH
CAUTIONS ON USE
1. Observe precautions for handling because this IC is an electrostatic sensitive device.
2. Form as wide a ground pattern as possible to minimize its impedance.
3. Keep the track length of the ground pins as short as possible (to prevent malfunction).
4. Connect a bypass capacitor to the Vcc pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions.
For soldering methods and conditions other than the recommended conditions, consult an NEC sales
representative.
μ
PC8139GR-7JH
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C.
Duration: 30 sec. max. (210°C or above)
Number of times: 2, Exposure limit: None
Note
IR35-00-2
VPS
Package peak temperature: 215°C.
Duration: 40 sec. max. (200°C or above)
Number of times: 2, Exposure limit: None
Note
VP15-00-2
Wave soldering
Soldering bath temperature : 260°C max.
Duration: 10 sec. max.
Number of times: 1, Exposure limit: None
Note
WS60-00-1
Partial heating method
Pin temperature: 300°C max.
Duration: 3 sec. max. (per side of device)
Exposure limit: None
Note
Note
Storage period (days) after opening the dry pack. Storage conditions: 25°C and 65% RH or less
(This product is not dry packed.)
Caution
Do not use different soldering methods together (except for pin partial heating.)
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
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