- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384040 > UPC4093G2 (NEC Corp.) J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | UPC4093G2 |
| 廠商： | NEC Corp. |
| 英文描述： | J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER |
| 中文描述： | J - FET輸入低失調(diào)運算放大器 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大小： | 90K |
| 代理商： | UPC4093G2 |
8
μ
PC4093
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document "
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL"(C10535E)
.
Type of Surface Mount Device
μ
PC4093G2: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
Vapor Phase Soldering
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave Soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
μ
PC4093C: 8-pin plastic DIP (300 mil)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Partial Heating Method
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPC4093 | J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER |
| UPC4093C | J-FET INPUT LOW-OFFSET OPERATIONAL AMPLIFIER |
| UPC8101 | 150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS |
| UPC8101GR | RF UP-CONVERTER WITH AGC FUNCTION + IF QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATION SYSTEMS |
| UPC8101GR-E2 | 150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC4093G2-E1-A | 制造商:Renesas Electronics Corporation 功能描述:Amp,Op amp,Single,J-FET,SOP8 |
| UPC4094 | 制造商:NEC 制造商全稱:NEC 功能描述:Bipolar Analog Integrated Circuits |
| UPC4094C | 制造商:NEC 制造商全稱:NEC 功能描述:J-FET INPUT LOW-OFFSET DUAL OPERATIONAL AMPLIFIER |
| UPC4094G2 | 制造商:NEC 制造商全稱:NEC 功能描述:J-FET INPUT LOW-OFFSET DUAL OPERATIONAL AMPLIFIER |
| UPC4094G2(E1-A) | 制造商:Renesas Electronics 功能描述:Cut Tape |
發(fā)布緊急采購，3分鐘左右您將得到回復。