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參數(shù)資料
| 型號： | UPC37M31TJ-E2-AZ |
| 元件分類： | 固定正電壓多路輸出標(biāo)準(zhǔn)穩(wěn)壓器 |
| 英文描述： | DUAL OUTPUT, FIXED POSITIVE REGULATOR, PSSO5 |
| 封裝： | SC-98, 5 PIN |
| 文件頁數(shù)： | 4/14頁 |
| 文件大?。?/td> | 113K |
| 代理商： | UPC37M31TJ-E2-AZ |
Data Sheet G16444EJ2V0DS
12
PC37Mxx Series
RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the
PC37Mxx series.
For more details, refer to the Semiconductor Device Mount Manual
(http://www.necel.com/pkg/en/mount/index.html).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
Type of Surface Mount Device
PC37MxxTJ: SC-98 (5-pin MP-3Z)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflows processes: 3 times or less.
IR35-00-3
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflows processes: 3 times or less.
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
PC37MxxHB: SC-99 (5-pin MP-3)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
5
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