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參數(shù)資料
| 型號： | UPC358 |
| 廠商： | NEC Corp. |
| 元件分類： | 運動控制電子 |
| 英文描述： | LOW POWER DUAL OPERATIONAL AMPLIFIERS |
| 中文描述： | 低功耗雙運算放大器 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 74K |
| 代理商： | UPC358 |
μ
PC358
9
RECOMMENDED SOLDERING CONDITIONS
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
For more details, refer to our document “
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL
”
(C10535E)
.
Type of Surface Mount Device
μ
PC358G2: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
Vapor phase soldering
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Types of Through-hole Device
μ
PC358C: 8-pin plastic DIP (300 mil)
μ
PC358HA: 9-pin slim SIP
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPC358C | LOW POWER DUAL OPERATIONAL AMPLIFIERS |
| UPC358G2 | LOW POWER DUAL OPERATIONAL AMPLIFIERS |
| UPC358HA | LOW POWER DUAL OPERATIONAL AMPLIFIERS |
| UPC393G2 | LOW POWER DUAL COMPARATORS |
| UPC393HA | LOW POWER DUAL COMPARATORS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPC358C | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPC358C-A | 制造商:Renesas Electronics 功能描述:OP Amp Dual GP }15V/30V 8-Pin PDIP Bulk 制造商:Renesas Electronics Corporation 功能描述:IC,Op-amp,Dual,UPC358C-A,NEC,DIP8 |
| UPC358G2 | 制造商:Panasonic Industrial Company 功能描述:IC |
| UPC358G2-A | 制造商:Renesas Electronics 功能描述:Dual General Purpose Amplifier Bulk 制造商:Renesas Electronics 功能描述:OP Amp Dual GP }15V/30V 8-Pin SOP Cut Tape 制造商:Renesas Electronics Corporation 功能描述:IC,Op-amp,Dual,SMT,UPC358G2-A,NEC,SOP8 制造商:Renesas 功能描述:OP Amp Dual GP ±15V/30V 8-Pin SOP |
| UPC358G2-E1-A | 制造商:Renesas Electronics 功能描述:Dual General Purpose Amplifier Cut Tape 制造商:Renesas 功能描述:OP Amp Dual GP ±15V/30V 8-Pin SOP |
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