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參數(shù)資料
| 型號： | UPC324 |
| 廠商： | NEC Corp. |
| 元件分類： | 運動控制電子 |
| 英文描述： | LOW POWER QUAD OPERATIONAL AMPLIFIER |
| 中文描述： | 低功耗四運算放大器 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大小： | 84K |
| 代理商： | UPC324 |
μ
PC324
8
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface mount device
μ
PC324G2: 14-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
Vapor Phase Soldering
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
Wave Soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Through-hole device
μ
PC324C: 14-pin plastic DIP (300 mil)
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260
°
C or below,
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (per each lead.)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
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參數(shù)描述 |
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| UPC3240TB-A | 功能描述:MMIC AMPLIFIER 6 PIN MINIMOLD RoHS:是 類別:RF/IF 和 RFID >> RF 放大器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 頻率:100MHz ~ 6GHz P1dB:9.14dBm（8.2mW） 增益:15.7dB 噪音數(shù)據(jù):1.3dB RF 型:CDMA，TDMA，PCS 電源電壓:2.7 V ~ 5 V 電流 - 電源:60mA 測試頻率:2GHz 封裝/外殼:0505（1412 公制） 包裝:帶卷 (TR) |
| UPC3240TB-E3-A | 功能描述:MMIC AMPLIFIER 6 PIN MINIMOLD RoHS:是 類別:RF/IF 和 RFID >> RF 放大器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 頻率:100MHz ~ 6GHz P1dB:9.14dBm（8.2mW） 增益:15.7dB 噪音數(shù)據(jù):1.3dB RF 型:CDMA，TDMA，PCS 電源電壓:2.7 V ~ 5 V 電流 - 電源:60mA 測試頻率:2GHz 封裝/外殼:0505（1412 公制） 包裝:帶卷 (TR) |
| UPC3240TB-EVAL-A | 功能描述:EVAL BOARD FOR UPC3240TB RoHS:是 類別:RF/IF 和 RFID >> RF 評估和開發(fā)套件，板 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 類型:GPS 接收器 頻率:1575MHz 適用于相關(guān)產(chǎn)品:- 已供物品:模塊 其它名稱:SER3796 |
| UPC3241TB-A | 功能描述:MMIC AMPLIFIER 6 PIN MINIMOLD RoHS:是 類別:RF/IF 和 RFID >> RF 放大器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 頻率:100MHz ~ 6GHz P1dB:9.14dBm（8.2mW） 增益:15.7dB 噪音數(shù)據(jù):1.3dB RF 型:CDMA，TDMA，PCS 電源電壓:2.7 V ~ 5 V 電流 - 電源:60mA 測試頻率:2GHz 封裝/外殼:0505（1412 公制） 包裝:帶卷 (TR) |
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