參數(shù)資料
型號(hào): UPC3215TB-E3
廠商: NEC Corp.
英文描述: 5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER
中文描述: 5伏,超級(jí)MINIMOLD硅單片寬帶放大器
文件頁(yè)數(shù): 7/8頁(yè)
文件大?。?/td> 68K
代理商: UPC3215TB-E3
Preliminary Data Sheet P14765EJ1V0DS00
7
μ
PC3215TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to V
CC
line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Note
IR35-00-3
VPS
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Note
VP15-00-3
Wave Soldering
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Note
WS60-00-1
Partial Heating
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Note
After opening the dry pack, keep it in a place below 25
°
C and 65 % RH for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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