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參數(shù)資料
| 型號(hào)： | UPC29S10 |
| 英文描述： | UPC29S00 Series Data Sheet | Data Sheet[01/2003] |
| 中文描述： | UPC29S00系列數(shù)據(jù)表|數(shù)據(jù)表[01/2003] |
| 文件頁數(shù)： | 9/20頁 |
| 文件大?。?/td> | 93K |
| 代理商： | UPC29S10 |
PC2900 Series
17
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
Fof more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface mount devices
PC2900T Series: MP-3Z
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°C or below (Package surface temperature),
IR35-00-2
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 2 times.
VPS
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-2
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 2 times.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Partial heating method
Pin temperature: 300
°C or below,
—
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Through-hole devices
PC2900HF Series: MP-45G
PC2900HB Series: MP-3
Process
Conditions
Wave soldering
Solder temperature: 260
°C or below,
(only to leads)
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
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相關(guān)代理商/技術(shù)參數(shù) |
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| UPC29S78GR-E1-A | 制造商:Renesas Electronics Corporation 功能描述: |
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